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Tsinghua Unigroup Unveils 5G, Storage and IoT Products at CITE2019, Winning Gold Awards

04/09/2019

On April 9, 2019, The 7th China Information Technology Expo (CITE2019) was magnificently kicked off at Shenzhen Convention & Exhibition Center. With the theme of “Driving Development by Innovation, Empowering the Future with Intelligence,” CITE2019 was jointly hosted by the State Ministry of Industry and Information Technology and Shenzhen Municipal People’s Government. Tsinghua Unigroup, together with its subsidiaries in chip and cloud network industries, attended the expo and built an exhibition area themed on “Shaping the Future with Innovations from Chips to Cloud”, showcasing the group’s latest technological achievements and products in the field of 5G. The exhibits included the newly-released 5G baseband chips and mobile phone prototypes, 5G small base station, as well as FPGA and other products that are compatible with 5G technology, fully demonstrating the innovation ability of Tsinghua Unigroup in the era of 5G.  


UNISOC’s 5G baseband chip IVY510, which made its official debut at a domestic exhibition, won the “CITE Gold Award” issued by expo. This continues the record of Tsinghua Unigroup’s chips winning this award for many consecutive years. 


It is worth mentioning that the micro-connector of Linxens, a subsidiary of Tsinghua Unigroup, and Unic Memory’s solid-state disk applying the 3D NAND flash memory chip of YMTC both ushered in their official debut at the CITE2019. Furthermore, for the first time, Tsinghua Unigroup used a sand table to demonstrate the R&D breakthroughs of its subsidiaries in the field of Internet of Things, fully embodying the Group’s integration capability and R&D strength of chips and cloud computing in the field of Internet of Things.


Powering the acceleration of 5G commercialization in an all-round manner


In addition to IVY510, the 5G baseband chip based on Makalu 5G communication technology platform, UNISOC will also support the commercial implementation and sales of the first batch of 5G device applications at the CITE2019, bringing a revolutionary 5G connection experience to consumers around the world and pressing ahead the acceleration of 5G commercialization in an all-round manner.


“The 5G in the future will never be an isolated network, but should be combined with many other wireless networks to provide a perfect experience”, said Zhou Chen, UNISOC’s Vice President. “IVY is a brand of pan-connected chip products of UNISOC, and it has achieved a number of breakthroughs in NB-IoT, wireless connectivity, smart city, smart wearable devices, smart home, and other fields,” he added.


It is known that IVY510 supports both SA (standalone) and NSA (Non-standalone) networking and fully meets the different communication and networking needs in the 5G development. Owing to its high transmission rate, IVY510 supports a wide range of high-traffic applications in the main scenarios of 5G.


Tsinghua Unigroup also exhibited a variety of 5G-related products and solutions ranging from chips to cloud computing, including Unigroup Guoxin’s FPGA products and solutions matched with the 5G base station network, and a series of New H3C’s 5G products and solutions ranging from white-boxed small base stations in ORAN architecture to bearer networks, telecom clouds and edge computing.


Promoting the steady development of the flash memory industry chain


The storage industry is an important link of Tsinghua Unigroup’s chip-to-cloud strategy. At the CITE2019, Tsinghua Unigroup unveiled the enterprise-class solid-state disk P8260, whose chips all adopt the core technologies of the group company, including the 32-layer 3D NAND flash chip of YMTC, the SSD controller chip of DERA, and the DRAM of Xi’an UniIC Semiconductors.


Aside from this, Tsinghua Unigroup’s full spectrum of storage products were also on show at the CITE2019, such as the high-end enterprise-class SSD product P8160 for the server market and S6110 for the mainstream market. P8160, also adopting the SSD controller of DERA, has performance strong enough to rival high-end products of international mainstream brands, and has been introduced on a large scale to Tsinghua Unigroup’s New H3C Group and other customers.


The technology accumulation of Tsinghua Unigroup’s subsidiaries in the field of storage and integrated circuits have greatly driven the development of the flash memory industry chain. Technologies from the XtackingTM technology, a blockbuster in 2018, to the 3D IC wafer-level integration technology were all highlighted at the CITE2019. In the meantime, a variety of terminal applications of the 32-layer 3D NAND flash chip of YMTC, such as fingerprint security U disk, personal computers and set-top boxes were also presented.


Facilitating digital transformation 


As one of the few domestic providers of industry-wide cloud network services covering products, consulting, design, construction and operation, Tsinghua Unigroup has a full range of cloud architecture products including computing, storage, network, security, hyper-converged systems and IT management systems, with its devices exported to more than 100 countries and regions and more than 50 million units operated online.


At the CITE2019, in the field of IT infrastructure, Tsinghua Unigroup unveiled CR19000, the industry’s first cluster router supporting cloudization, together with hyper-converged architectures and enterprise-class midrange converged storage products; in the field of cloud network applications, the main exhibit was New H3C Group’s smart city solution which covers the entire lifecycle of new smart city construction from top-level design, business consulting, integrated delivery to smart city operation. Other products concurrently exhibited included: UniCloud supported by the cloud platform, with operation services as the engine, ecological development as the primary goal, and “optimizing governance”, “benefiting people” and “promoting industries” as the focus; UNIPower, an intelligent manufacturing public service platform that offers a full range of industrial cloud services and intelligent manufacturing system solutions for industrial customers; as well as the “digital red wall” solutions serving urban management.


“New H3C Group will continue to focus on innovation-related investment and development to facilitate the digital transformation of Chinese enterprises”, said Han Zhigang, Co-president of New H3C Group. “The company will gather industry solutions by taking the application-driven model and leveraging the company’s years of experience and best practices in the IT construction of various industries. By taking advantage of the breakthroughs in typical business, a replicable and scalable business model will be formed and an ecosystem of win-win cooperation will be built”, he continued.


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